July 15 Webinar on Drop Simulation for electronics products using Ansys

July 15 Webinar on Drop Simulation for electronics products using Ansys
Introduction Drop test analysis always is the area of interest in many industries like electronics and high-tech manufacturing. The structure of a product is related to its strength, deformation, fatigue, vibration, noise, heat transfer and destruction. All companies are seeking the best way to make their products more robust and reliable. Information regarding what would happen when these products were dropped from a certain height can be valuable for a better product design. However, the analysis function attached to traditional CAD software has no way to achieve the computational complexity and accuracy of professional CAE software.  
Ansys LS-DYNA is the most used explicit simulation program in the world and is capable of simulating the response of materials to short periods of severe loading. In this webinar, CYBERNET Malaysia engineer is going to talk about how LS-DYNA can be used to simulate complex models with control over all the details of the problem. 
Suitable for

CAE engineers and students in Mechanical department who are doing structural analysis. 

Date/Time July 15 2021
10:00-11:30 UTC+8, Singapore, Kuala Lumpur, Manila
9:00-10:30 UTC+7, Bangkok, Hanoi, Jakarta 

Please mind the webinar time difference in your timezone.

E-mail: information@cybernet.asia
Singapore/ Malaysia 
Jim +6016 9262 897 

Long +84 988 556 301

Peerachart +66 806224834


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