July 15 Webinar on Drop Simulation for electronics products using Ansys
|Introduction||Drop test analysis always is the area of interest in many industries like electronics and high-tech manufacturing. The structure of a product is related to its strength, deformation, fatigue, vibration, noise, heat transfer and destruction. All companies are seeking the best way to make their products more robust and reliable. Information regarding what would happen when these products were dropped from a certain height can be valuable for a better product design. However, the analysis function attached to traditional CAD software has no way to achieve the computational complexity and accuracy of professional CAE software.
Ansys LS-DYNA is the most used explicit simulation program in the world and is capable of simulating the response of materials to short periods of severe loading. In this webinar, CYBERNET Malaysia engineer is going to talk about how LS-DYNA can be used to simulate complex models with control over all the details of the problem.
CAE engineers and students in Mechanical department who are doing structural analysis.
|Date/Time||July 15 2021
10:00-11:30 UTC+8, Singapore, Kuala Lumpur, Manila
9:00-10:30 UTC+7, Bangkok, Hanoi, Jakarta
Please mind the webinar time difference in your timezone.